型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LTC4307IMS8#TRPBF | ADI (亚德诺半导体) | MSOP8 | 21+ | 详细 | |
| DS2431P+T&R | MAXIM(美信) | TSOC-6 | 23+ | 详细 | |
| TLP2303 | TOSHIBA(东芝) | SOP5 | 23+ | 详细 | |
| TLP290GR-TP.SE | TOSHIBA(东芝) | SOP4 | 22+ | 详细 | |
| TLP290GB-TP | TOSHIBA(东芝) | SOP4 | 23+ | 详细 | |
| TLP185 | TOSHIBA(东芝) | SOP4 | 23+ | 详细 | |
| TLP184GB-TPL.SE | TOSHIBA(东芝) | SOP4 | 23+ | 详细 | |
| NCV1117ST33T3G | ON(安森美) | SOT223 | 21+ | 详细 | |
| NCP1031DR2G | ON(安森美) | SOP8 | 23+ | 详细 | |
| MJD350T4G | ON(安森美) | TO-252 | 20+ | 详细 | |
| MJD253T4G | ON(安森美) | TO-252 | 22+ | 详细 | |
| 6N137SDM | ON(安森美) | SOP8 | 23+ | 详细 | |
| 1SMB5932BT3G | ON(安森美) | SMB | 20+ | 详细 | |
| 1SMA5918BT3G | ON(安森美) | SMA | 22+ | 详细 | |
| TJA1051TK3,118 | NXP(恩智浦) | HVSON8 | 22+ | 详细 | |
| PCA9509DP | NXP(恩智浦) | TSSOP8 | 22+ | 详细 | |
| PIC16F1936T-I/SO | MICROCHIP(微芯) | SOP28 | 22+ | 详细 | |
| LAN8720AI-CP-TR | MICROCHIP(微芯) | QFN24 | 23+ | 详细 | |
| DS2480B+T&R | MAXIM(美信) | SOP8 | 23+ | 详细 | |
| OP27GSZ-REEL7 | ADI (亚德诺半导体) | SOP8 | 22+ | 详细 | |
| CS51414EDR8G | ON(安森美) | 详细 | |||
| PCA9548APW | NXP(恩智浦) | 详细 | |||
| MAX3442EESA+T | MAXIM(美信) | 详细 | |||
| MAX604ESA+T | MAXIM(美信) | 详细 | |||
| DS1302ZN+T&R | MAXIM(美信) | 详细 | |||
| LT3796EFE#TRPBF | ADI (亚德诺半导体) | 详细 | |||
| DS18B20U+T&R | MAXIM(美信) | 详细 | |||
| ADUM3201ARZ-RL7 | ADI (亚德诺半导体) | 详细 | |||
| ADUM1251ARZ-RL7 | ADI (亚德诺半导体) | 详细 | |||
| ADUM1201ARZ-RL7 | ADI (亚德诺半导体) | 详细 | |||
| ADP2164ACPZ-R7 | ADI (亚德诺半导体) | 详细 | |||
| AD7705BRZ-REEL | ADI (亚德诺半导体) | 详细 | |||
| TPS53315RGFR | TI(德州仪器) | WQFN40 | 23+ | 详细 | |
| TPS5420DR | TI(德州仪器) | SOP8 | 22+ | 详细 | |
| THS4521IDGKR | TI(德州仪器) | VSSOP8 | 23+ | 详细 | |
| REF02BU/2K5 | TI(德州仪器) | SOP8 | 23+ | 详细 | |
| OPA4376AIPWR | TI(德州仪器) | TSSOP14 | 23+ | 详细 | |
| LMC6482IMX/NOPB | TI(德州仪器) | SOP8 | 23+ | 详细 | |
| LM22675QMRX-ADJ/NOPB | TI(德州仪器) | SOP8 | 22+ | 详细 | |
| LM7332MAX/NOPB | TI(德州仪器) | SOP8 | 22+ | 详细 |
